MECHANIC MagTin Magnetic Levitation Chip Tin Planting Platform Digital Oscilloscopes

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Description

MECHANIC MagTin Magnetic Levitation Chip Tin Planting Platform Digital OscilloscopesMECHANIC MAG Tin magnetic levitation chip tin planting platform CPU hard disk position steel mesh for iPhone series Huawei series Qualcomm series. Mechanical magnetic levitation chip tin planting platform with template is suitable for iPhone Huawei Qualcomm IC CPU Nand flash memory font re ball soldering. Option: 1. Standard set: MagTin positioning platform + iPhone A8 A15 CPU stencil(8pcs). 2. Qualcomm series stencil only(7pcs). 3. Huawei series

compatible for Macbook Pro 15” A1286 A1398 (2011-2012)

EM93LC76@16bit

S-998P Power supply voltage AC 220V~240V 50Hz Vacuum pump Dual Diaphragm type Power consumption 100W Motor Power ≤20W Heat-generating components 80W ceramic heater Temperature range 350℃~450℃ Temperature control accuracy ±2℃ Vacuum degree Greater than 650mmHg Insulation Resistance ≥100MΩ Work Continuous Circuit control system No interference NOZZLE specifications ∮1

more accurate data detection

Probe: imported probe

Focus arm: 76mm diameter

1pcX UPA Adapter Type16 Motorola MC68HC05B4/B6/B8/B16/B32+MC68HC(7)05X16/X32-QFP64

Soldering work requires a flux

The programming time is proportional to the capacity

Circular light source AC90V-240V eliminates shadows and reflections

so when the PCB ministries of components of the tin pin point in near melting point

Such as GALAXYCORE

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